Download Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah, Yehea Ismail, Visit Amazon's Alaa El-Rouby PDF

By Khaled Salah, Yehea Ismail, Visit Amazon's Alaa El-Rouby Page, search results, Learn about Author Central, Alaa El-Rouby,

This booklet provides a wide-band and expertise self sustaining, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version debts for quite a few results, together with dermis impact, depletion capacitance and within sight touch results. Readers will take advantage of in-depth insurance of strategies and know-how corresponding to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. recommendations coated are verified through the use of TSVs in purposes corresponding to a spiral inductor and inductive-based communique process and bandpass filtering.

Show description

Read or Download Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF

Best circuits books

The circuits and filters handbook. Fundamentals of circuits and filters

This quantity, drawn from the Circuits and Filters instruction manual, specializes in arithmetic fundamentals; circuit components, units, and their versions; and linear circuit research. It examines Laplace transformation, Fourier tools for sign research and processing, z-transform, and wavelet transforms. It additionally explores community legislation and theorems, terminal and port represetnation, research within the frequency area, and extra.

Fundamentals of Liquid Crystal Devices (Wiley Series in Display Technology)

From computer desktops and cellphones to electronic cinema, Liquid Crystal screens (LCDs) are essential parts in an expanding array of hugely fascinating patron electronics and verbal exchange units, and are already the primary know-how utilized in flat panel displays. This inter-disciplinary publication is meant as an introductory advisor to the elemental homes of liquid crystals and their purposes in demonstrate and photonic units, supplying a simple realizing of the physics, optics, electro-optics, and fabric elements for cutting-edge reveal and photonic units.

Built-in-Self-Test and Digital Self-Calibration for RF SoCs

This publication will introduce layout methodologies, often called Built-in-Self-Test (BiST) and Built-in-Self-Calibration (BiSC), which complement the robustness of radio frequency (RF) and millimeter wave (mmWave) built-in circuits (ICs). those circuits are utilized in present and rising communique, computing, multimedia and biomedical items and microchips.

Alternating Current Multi-Circuit Electric Machines: A New Approach to the Steady-State Parameter Determination

This ebook info an technique for awareness of the sector decomposition idea. The booklet offers the tools in addition to thoughts and systems for constructing electrical desktop circuit-loops and opting for their parameters. The tools built were discovered utilizing the types of machines with laminated and reliable rotor having classical constitution.

Additional info for Arbitrary Modeling of TSVs for 3D Integrated Circuits

Sample text

Louisa, G. Passemardc, Challenges for 3D IC integration: bonding quality and thermal managementc, IEEE, 2007 31. Y. J. O. C.  681–684 32. C. Chiang, S.  429–436 33. A. Rahman, R. Reif, System-level performance evaluation of three-dimensional integrated circuits. IEEE Trans. VLSI Syst. (Special Issue on System-Level Interconnect Prediction) 8(6), 671–678 (2000) 34. com/ 35. com/ 36. html 37. B. -L. Hung, F. Wang, Y. Xie, V. J. pdf 38. com/ 39. T. Yan, Q. Dong, Y. Takashima, Y. Kajitani, How does partitioning matter for 3D floorplanning?

Therefore, biasing the silicon substrate should alter the capacitance of the TSVs. So, now the TSVs are no longer a wire but behave as a variable capacitor (depending on the bias voltage), similar to a device (such as a MOS capacitor). The difference between 3D interconnect and 2D interconnect is that 2D wires have finite width and thickness, but infinite length. 3D wires have finite width, thickness, and finite length. 6. The shape can be rectangular or circular. But, from the simulation results, it can be found that the shape can affect the results very little.

Reduced power 8. Reduced packaging cost 9. Elimination of wire bonds 10. EMI and shielding 11. High bandwidth computer architectures 12. Use only one set of I/O pads to minimize parasitics due to I/O 13. Better reliability 14. Override the saturation of Moore’s law including bonding wires, TSV interconnections (which is a new silicon-based 3D packaging structure), metal bumps, and contactless communication (inductive and capacitive coupling). 4 summarizes the main difference between those four types of interconnects.

Download PDF sample

Rated 4.10 of 5 – based on 40 votes